GROWTH RATE OF INTERMETALLIC COMPOUNDS IN AL/CU BIMETAL PRODUCED BY COLD ROLL WELDING PROCESS
作者： M. Abbasi , A. Karimi Taheri , M.T. Salehi
DOI: 10.1016/S0925-8388(01)00872-6
关键词:
摘要: … of intermetallic compounds at the interface of cold roll bonded Al/Cu bimetal at 250C and compare the … It was observed that the strength and electrical conductivity are greatly reduced by …
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