Ternary Ag/Epoxy Adhesive with Excellent Overall Performance
作者： Yan-Hong Ji , Yu Liu , Gui-Wen Huang , Xiao-Jun Shen , Hong-Mei Xiao
关键词:
摘要: Excellent electrical conductivity (EC) generally conflicts with high lap shear strength (LSS) for electrically conductive adhesives (ECAs) since EC increases while LSS decreases increasing filler content. In this work, the ECAs excellent overall performance are developed based on ternary hybrid of Ag microflakes (Ag-MFs), nanospheres (Ag-NSs), and nanowires (Ag-NWs). First, a low silver content adhesive system is determined. Then, effects relative contents fillers studied. It shown that small amount Ag-NSs or Ag-NWs can dramatically improve Ag-MF/epoxy adhesives. The appropriate have synergistic effect in improving EC. Meanwhile, as-prepared reaches an optimal value. Both ECA 40 wt % higher than those commercial filled w...
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sci-hub.se 参考文章(46)
Hui-wang Cui, Qiong Fan, Dong-sheng Li, Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging Polymer International. ,vol. 62, pp. 1644- 1651 ,(2013) , 10.1002/PI.4461
Behnam Meschi Amoli, Ehsan Marzbanrad, Anming Hu, Y. Norman Zhou, Boxin Zhao, Electrical Conductive Adhesives Enhanced with High‐Aspect‐Ratio Silver Nanobelts Macromolecular Materials and Engineering. ,vol. 299, pp. 739- 747 ,(2014) , 10.1002/MAME.201300295
YI Li, Kyoung-sik Moon, CP Wong, Electronics Without Lead Science. ,vol. 308, pp. 1419- 1420 ,(2005) , 10.1126/SCIENCE.1110168
Shilong Chen, Konghua Liu, Yuanfang Luo, Demin Jia, Hong Gao, Guojun Hu, Lan Liu, In situ preparation and sintering of silver nanoparticles for low-cost and highly reliable conductive adhesive International Journal of Adhesion and Adhesives. ,vol. 45, pp. 138- 143 ,(2013) , 10.1016/J.IJADHADH.2013.04.004
Rongwei Zhang, Wei Lin, Kevin Lawrence, C.P. Wong, Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications International Journal of Adhesion and Adhesives. ,vol. 30, pp. 403- 407 ,(2010) , 10.1016/J.IJADHADH.2010.01.004
Dapeng Chen, Xueliang Qiao, Xiaolin Qiu, Jianguo Chen, Renzhi Jiang, Large-scale synthesis of silver nanowires via a solvothermal method Journal of Materials Science: Materials in Electronics. ,vol. 22, pp. 6- 13 ,(2011) , 10.1007/S10854-010-0074-2
Hoang-Vu Nguyen, Erik Andreassen, Helge Kristiansen, Knut E. Aasmundtveit, Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres IEEE Transactions on Components, Packaging and Manufacturing Technology. ,vol. 3, pp. 1084- 1093 ,(2013) , 10.1109/TCPMT.2013.2259166
M. Zulkarnain, M. Mariatti, I. A. Azid, Effects of hybrid fillers based on micro- and nano-sized silver particles on the electrical performance of epoxy composites Journal of Materials Science: Materials in Electronics. ,vol. 24, pp. 1523- 1529 ,(2013) , 10.1007/S10854-012-0965-5
Fatang Tan, Xueliang Qiao, Jianguo Chen, Hongshui Wang, Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives International Journal of Adhesion and Adhesives. ,vol. 26, pp. 406- 413 ,(2006) , 10.1016/J.IJADHADH.2005.06.005
I Novák, I Krupa, I Chodák, None, Electroconductive adhesives based on epoxy and polyurethane resins filled with silver-coated inorganic fillers Synthetic Metals. ,vol. 144, pp. 13- 19 ,(2004) , 10.1016/J.SYNTHMET.2004.01.001