Apparatus and method for optical communications
作者： Fei Yu , Qi Deng
DOI:
关键词:
摘要: An integrated circuit package includes a substrate having recess formed along at least portion of perimeter the substrate, and an optical die opto-electric circuitry, coupled to such that with circuitry overhangs recess. The also unit disposed in signals emitted by are reflected away from incident onto circuitry.
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