Deposition and characterization of TaN–Cu nanocomposite thin films
作者： J.H. Hsieh , C.M. Wang , C. Li
DOI: 10.1016/J.SURFCOAT.2005.07.039
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摘要: Abstract TaN–Cu nanocomposite thin films with Cu nanoparticles dispersed in TaN matrix were prepared by reactive co-sputtering of Ta and the plasma N 2 Ar. After deposition, annealed using RTA (Rapid Thermal Annealing) at 400 °C for 2, 4, 8 min respectively to induce nucleation growth particles. XRD TEM both applied characterize phases microstructures this study. The results reveal that incorporation will result fine or near-amorphous phase. During annealing, nano-particles emerge grow. Consequently, hardness Young's modulus values increase decrease annealing time, depending on content morphology (particularly, preferred orientation). nitrogen higher due formation stoichiometric
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