作者: Hiroyuki Sumitomo , Satoshi Kajiyama , Hiroyuki Oguri , Takeshi Sakashita , Toru Yamamoto
DOI: 10.1109/JSTQE.2007.903488
关键词:
摘要: Large-scale fabrication processes of high-power single-lateral-mode laser diodes (LDs) have been successfully demonstrated for the first time using 4-inch-wafer process technology. An excellent uniformity LD characteristics is obtained over an 88-mm-diameter area 4-inch wafer with small deviation, e.g., sigma/ave. = 3.5% (ave. plusmn sigma 73.5 2.6 mA) threshold current, and 0.12% (658.00 0.79 nm) peak wavelength. The LDs show stable kink-free operation 400 mW even at a high temperature 75degC current 600 mA.