Variation and control of bond force

摘要: A lead wire bonding machine is described for ball the end of a held in tool to die pad an integrated circuit chip and wedge segment spaced from bond frame finger during successive cycles. The includes variable linear drive such as solenoid or small motor coupled head applying first force second bonding. control other delivers current having desired profile amplitude wave envelope with pads by delivering form fingers. generator generates envelopes achieving so that may be varied according at particular site. Thus, modulated welding requirements different fingers composition constituent metals substrate.