Method of producing a via in a reconstituted substrate
作者： Francois Baleras , David Henry , Jean-Charles Souriau
DOI:
关键词:
摘要: A method of producing an electronic connection device, including: a) formation, in a plane support substrate, at least one first contact element and, direction approximately perpendicular to the plane, second having end electrical with or elements and end, including more metal tracks standing up along surface substrate; b) then positioning component elements; c) encapsulation component(s) elements, ends being flush encapsulating material.
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