Application of Carbon Nanotubes to Thermal Interface Materials

作者: Drazen Fabris , Michael Rosshirt , Christopher Cardenas , Patrick Wilhite , Toshishige Yamada

DOI: 10.1115/1.4003864

关键词:

摘要: … Two types of TIMs are tested based on the addition of carbon nanotubes (CNTs): one mixed with a commercial TIM product and the other only CNTs and silicone oil. The materials are …

参考文章(12)
A. Devpura, P.E. Phelan, R.S. Prasher, Percolation theory applied to the analysis of thermal interface materials in flip-chip technology intersociety conference on thermal and thermomechanical phenomena in electronic systems. ,vol. 1, pp. 21- 28 ,(2000) , 10.1109/ITHERM.2000.866803
Xuejiao Hu, Linan Jiang, K.E. Goodson, Thermal conductance enhancement of particle-filled thermal interface materials using carbon nanotube inclusions intersociety conference on thermal and thermomechanical phenomena in electronic systems. ,vol. 1, pp. 63- 69 ,(2004) , 10.1109/ITHERM.2004.1319155
Savas Berber, Young-Kyun Kwon, David Tománek, Unusually High Thermal Conductivity of Carbon Nanotubes Physical Review Letters. ,vol. 84, pp. 4613- 4616 ,(2000) , 10.1103/PHYSREVLETT.84.4613
J.P Gwinn, R.L Webb, Performance and testing of thermal interface materials Microelectronics Journal. ,vol. 34, pp. 215- 222 ,(2003) , 10.1016/S0026-2692(02)00191-X
Ravi S. Prasher, Surface Chemistry and Characteristics Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials Journal of Heat Transfer-transactions of The Asme. ,vol. 123, pp. 969- 975 ,(2001) , 10.1115/1.1388301
R. Prasher, Thermal Interface Materials: Historical Perspective, Status, and Future Directions Proceedings of the IEEE. ,vol. 94, pp. 1571- 1586 ,(2006) , 10.1109/JPROC.2006.879796
Jun Xu, Timothy S. Fisher, Thermal Contact Conductance Enhancement With Carbon Nanotube Arrays Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. pp. 559- 563 ,(2004) , 10.1115/IMECE2004-60185
David G. Cahill, Wayne K. Ford, Kenneth E. Goodson, Gerald D. Mahan, Arun Majumdar, Humphrey J. Maris, Roberto Merlin, Simon R. Phillpot, Nanoscale thermal transport Journal of Applied Physics. ,vol. 93, pp. 793- 818 ,(2003) , 10.1063/1.1524305
B.B. Mikić, THERMAL CONTACT CONDUCTANCE; THEORETICAL CONSIDERATIONS International Journal of Heat and Mass Transfer. ,vol. 17, pp. 205- 214 ,(1974) , 10.1016/0017-9310(74)90082-9
V. Singhal, T. Siegmund, S.V. Garimella, Optimization of thermal interface materials for electronics cooling applications IEEE Transactions on Components and Packaging Technologies. ,vol. 27, pp. 244- 252 ,(2004) , 10.1109/TCAPT.2004.828587