An intelligent vision system for inspection of packaged ICs

摘要: A visual inspection system for recognizing defects in IC packages is presented. In this system, the iconic domain of two-dimensional gray level image analysis based on feature extraction method used. software package developed to carry out that may exist leads and surface chip. The recognition these achieved by comparing data with a predefined threshold value. To improve speed performance an auto-windowing routine incorporated map relevant areas processing. algorithms various processes used are outlined. From experimental results obtained, it shown high accuracy good reliability can be proposed system. >