A novel clustered hard mask technology for dual damascene multilevel interconnects with self-aligned via formation using an organic low k dielectric

作者： N. Aoi , E. Tamaoka , M. Yamanaka , S. Hirao , T. Ueda

DOI: 10.1109/VLSIT.1999.799330

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摘要: A novel clustered hard mask technology with self-aligned via formation is developed. This provides dual damascene multilevel interconnects using an organic low k dielectric without misalignment problems or degradation of film properties.

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A novel clustered hard mask technology for dual damascene multilevel interconnects with self-aligned via formation using an organic low k dielectric

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A novel clustered hard mask technology for dual damascene multilevel interconnects with self-aligned via formation using an organic low k dielectric

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