Avd hardmask for damascene patterning
作者： Kevin J. Fischer , Ruth A. Brain , Michael A. Childs
DOI:
关键词:
摘要: A method including forming a dielectric layer on contact point of an integrated circuit structure; hardmask material surface the layer; and at least one via in to using as pattern. An apparatus substrate active point; having opening therein for interconnect material; through point.
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