Method for producing displays and modular components
作者： Lynn K. Wiese , Marvin Lumbard
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摘要: Processing techniques for various modular components provide surface mount structures single device (10) and multiple (FIGS. 6 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front connective strips (22, 24) are formed. Devices (15, 16) mounted land areas (13, 34) wire bonded pads (14). is coated epoxy encapsulate the devices in layer having an outer formed into optional lenses (262, 263). then separated components.
lens.org 参考文章(12)
Miura C O Takiron Co. Ltd. Masanobu, Dot matrix luminous display ,(1985)
Shinzo Anazawa, Toshiro Kuroda, Ceramic substrate assembly for electronic circuits having ceramic films thereon for intercepting the flow of brazing agents ,(1974)
Ching-Ping Wong, Encapsulated electronic circuit ,(1982)
Osamu Ichikawa, Tetsuo Sadamasa, Led module for a flat panel display unit ,(1981)
William J. Latz, Jason C. S. Lai, Thomas J. Mandler, Electronic display with lens matrix ,(1985)
Winthrop Blythe, Saul Lederhandler, Robert Maggio, Electric display device ,(1975)
Shozo Abe, Ceramic leadless packages and a process for manufacturing the same ,(1983)
Victor J. Toggart, Richard F. Kingsbury, Robert O. Herendeen, Method for making display device ,(1980)
Harold W Stetson, Method of making multilayer circuits ,(1962)
Kaoru Konishigawa, Akiyoshi Nakaoka, Fuminori Hirose, Manufacture of leadless light emitting diode chip ,(1980)