Investigation of etching techniques for superconductive Nb/Al-Al/sub 2/O/sub 3//Nb fabrication processes
作者： A.W. Lichtenberger , D.M. Lea , F.L. Lloyd
DOI: 10.1109/77.233938
关键词:
摘要: Wet etching, CF/sub 4/ and SF/sub 6/ reactive ion etching (RIE), RIE/wet hybrid Cl-based RIE, milling liftoff techniques have been investigated for use in superconductive Nb/Al-Al/sub 2/O/sub 3//Nb fabrication processes. High-quality superconductor-insulator junctions fabricated using a variety of these methods; however, each technique offers distinct tradeoffs given process an wafer design. In particular, it was shown that provides excellent RIE chemistry low-voltage anisotropic Nb with high selectivity to Al. The tool has greatly improved the trilevel resist junction insulation process. Excellent repeatability, respect quartz, submicron resolution make Cl/sub 2/+BCl/sub 3/+CHCl/sub 3/ very attractive trilayer patterning. >
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