Process for manufacturing a membrane microelectromechanical device, and membrane microelectromechanical device

摘要: Disclosed herein is a microelectromechanical device and process for manufacturing same. One or more embodiments may include forming semiconductor structural layer separated from substrate by dielectric layer, opening plurality of trenches through the exposing portion layer. A sacrificial selectively removed in membrane regions so as to free corresponding form membrane. To close trenches, wafer brought an annealing temperature time interval such way cause migration atoms reach minimum energy configuration.