DOI: 10.5772/9062
关键词:
摘要: Modern communication systems require microwave components of high performance and small size. In particular, microstrip are always in demand because low profile lightweight. However, despite many advances, component miniaturization still remains challenging. One the ways to solve this problem is introduce capacitive loading or stepped impedance device design. Capacitive loads different types were often employed monopole patch antennas reduce their dimensions (Lacey et al., 1996; Delaveaud 1998). Stepped (Sagava, 1997) has been also frequently used resonators, including ones. For example, approach was design open-loop filter, which width gradually increased toward slot that resulted reduced size wider upper stop-band (Hong & Lancaster, 1997). Size reduction improvement characteristics an filter reported for filters when symmetrically located patches open stubs added (Banciu 2002). efficiency limited by maximum possible additional sections. Another option using higher permittivity dielectric substrates. meets serious problems, such as mismatch mutual coupling between components. This Chapter describes efficient way parameter optimization engineering substrates with local inclusions layers dielectrics provide compression electromagnetic wave. Such utilizes advantages materials tuning, while simultaneously providing solutions matching problems. The outlines strategy combination achieve enhanced functions. A general concept applied choose optimal locations constant within structure accordance simulated field distributions at frequencies operation. Full-wave modeling develop designs. 10