Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same
作者： Yoon Boun , Kim Chae Lyoung , Kim Tae-Hong , Han Sol , Lee Hyosan
DOI:
关键词:
摘要: A cleaning apparatus for removing particles from a substrate is provided. The includes first unit including dual nozzle supplying, to substrate, chemical liquid and spray dissolving the liquid, second different being same as liquid.
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