作者: C.G Kang , J.S Choi
DOI: 10.1016/S0924-0136(97)00234-3
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摘要: Abstract Semi-solid materials (SSM) were fabricated under two fabrication conditions by mechanical stirring. Re-heating of SSM with the methods (mechanical and electro-magnetic stirring) studied holding times three re-heating temperatures. forging was conducted different die temperatures ( T =250, 300 350°C) gate types (straight orifice gate). The properties semi-solid components can be predicted indirectly, from microstructure at a cooling rate 0.0094°C s −1 stirring speed 1000 rpm. initial affects in process re-heating, smaller providing more globular after re-heating. held for 15 min is superior to that 20 terms globulization size. effect temperature not serious fill cavity straight die. are those gate, e.g. an ultimate strength U =320 MPa compared =250 gate.