Above motherboard interposer with peripheral circuits
作者： Morgan Johnson , Frederick G. Weiss
DOI:
关键词:
摘要: An interposer substrate includes an array of interconnects in the substrate, connectors arranged accordance with for a processor on circuit at least one conductive trace connection connector interconnects, parallel to such that no electrical exists between and corresponding peripheral residing trace.
google.ca 参考文章(14)
Douglas C Chambers, None, Methods and apparatus for a flexible circuit interposer ,(2006)
Kurt Peter Wachtler, Flexible interposer for stacking semiconductor chips and connecting same to substrate ,(2011)
Wuu Yean Tay, Teck Kheng Lee, Kian Chai Lee, Apparatus for flip-chip packaging providing testing capability ,(2002)
Yeu-Lih Lin, Li-Kuang Tan, Tseng-Hsiang Hu, Light-emitting diode assembly and method of fabrication ,(2006)
Carl E. Hoge, David H. Hartke, James J. Hjerpe Kaskade, II Joseph T. DiBene, Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management ,(2001)
David Jacob Perlman, John Edward Cronin, Claude Louis Bertin, James Marc Leas, Kenneth Edward Beilstein, Wayne John Howell, Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging ,(1995)
Steven Webster, Thomas P. Glenn, Donald Craig Foster, Charles A. Shermer, Active heat sink for cooling a semiconductor chip ,(2001)
Albert Sutono, Flexible interposer system ,(2007)
Mark Trobough, Non-intrusive interposer for accessing integrated circuit package signals ,(2007)
Jason Alan Yelinek, Feng-Cheng Su, Chi-Chang Fu, Kuo Ching Huang, Data storage device carrier system ,(2009)