Experimental verification and comparison of different tailoring models for spacecraft electronics thermal cycling tests

作者: Xin-Yan Ji , Guo-Qing Liu , Jing Wang , Xiao-Ning Yang , Shu-Hong Xiang

DOI: 10.1016/J.ACTAASTRO.2019.03.037

关键词:

摘要: Abstract Thermal cycling tests (TCT) have been widely used for performance demonstration and reliability validation of the spacecraft electronics. The integrated tailoring model can provide customized testing conditions TCT different electronics, which is with traditional unified in MIL-STD-1540. Considering influence welding material, defect degrees test levels, experimental verification had done on solder samples. evaluation indicators including cost, simulation bias accuracy defined compared between two methods. results show that Sn/Pb samples, effects methods are same. But other materials method be to achieve better environmental stress screening lower cost than method. Such as SAC solder, increased by 0–10%, decreased 0–7%.

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