Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling
作者： Z. Sun , L. Benabou , P.R. Dahoo
DOI: 10.1016/J.ENGFRACMECH.2013.05.009
关键词:
摘要: … is degraded with the increase of damage level. Temperature … The temperature is applied uniformly to the entire assembly, … is almost stable, which corresponds to a stable stage of crack …
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