Fatigue life prediction for solder interconnects in IGBT modules by using the successive initiation method
作者： Nilesh Ghodke , Dipesh Kumbhakarna , Satej Nakanekar , Sandeep Tonapi
DOI: 10.1109/ITHERM.2014.6892335
关键词: Power semiconductor device 、 Soldering 、 Bipolar junction transistor 、 Insulated-gate bipolar transistor 、 Materials science 、 Energy (signal processing) 、 Thermal 、 Electronic engineering 、 Reliability (semiconductor) 、 Layer (object-oriented design) 、 Mechanical engineering
摘要: Insulated gate bipolar transistors are the power semiconductors used for high current applications as a switching device. It is widely in electrical and hybrid vehicles. has become increasingly important to understand reliability of these modules. The lifetime prediction based on assumption that solder interconnections weakest part module assembly failure cause inelastic deformation energy accumulated within material. In this paper, effects thermo-mechanical fatigue layer interface have been investigated. A 2D model 6 pack, 1200V IGBT analysis. This study presents simulation crack initiation propagation under loading. Successive technique propagate layer. cyclic creep-fatigue damage thermal loading modeled using Energy Partitioning predict life an module.
sci-hub.se 参考文章(6)
James D. Gyllenskog, Fatigue life analysis of T-38 aileron lever using a continuum damage approach Utah State University. ,(2010)
Leila Jannesari Ladani, Damage Initiation and Evolution in Voided and Unvoided Lead Free Solder Joints Under Cyclic Thermo-Mechanical Loading ,(2007)
Z. Sun, L. Benabou, P.R. Dahoo, Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling Engineering Fracture Mechanics. ,vol. 107, pp. 48- 60 ,(2013) , 10.1016/J.ENGFRACMECH.2013.05.009
Hua Ye, Minghui Lin, Cemal Basaran, Failure modes and FEM analysis of power electronic packaging Finite Elements in Analysis and Design. ,vol. 38, pp. 601- 612 ,(2002) , 10.1016/S0168-874X(01)00094-4
Mika Ikonen, Power cycling lifetime estimation of IGBT power modules based on chip temperature modeling Lappeenranta University of Technology. ,(2012)
N.Y.A. Shammas, M.P. Rodriguez, A.T. Plumpton, D. Newcombe, Finite element modelling of thermal fatigue effects in IGBT modules IEE Proceedings - Circuits, Devices and Systems. ,vol. 148, pp. 95- 100 ,(2001) , 10.1049/IP-CDS:20010293