Finite element modelling of thermal fatigue effects in IGBT modules
作者： N.Y.A. Shammas , M.P. Rodriguez , A.T. Plumpton , D. Newcombe
关键词:
摘要: The effects of progressive thermal fatigue the solder layer interface on performance power module packages have been investigated. Specifically, in paper analysis an 800 A-1800 V IGBT using finite element techniques is performed. use this technique for modelling thus demonstrated, and a method estimating lifetime soldered modules based Coffin-Manson relation also given. Assessed parameters three-dimensional model are resistance, heat flux distribution through different layers maximum die temperature. critical crack length at which resistance significantly increases determined from two-dimensional model. temperature excursion shear strain estimated dynamic analysis. Finally, all achieved models calibrated by comparison predicted results with simple theory direct measurements.
iee.org.uk参考文章(5)
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