Method for making a test probe for semiconductor devices

摘要: An intricate micro-probe for testing beam-lead semiconductor devices such as integrated circuits is formed from a molded insulator, die-cut compensating member and photo-etched contact elements. The configuration of the various elements probe that mechanized fabrication assembly small are possible. blank which also yields connected frame having unique expansion feature permitting three-dimensional shaping without stretching thermally embedded into plastic insulator. A accomplished with pyramidal tool cut-off blade trims against tool.