Packaging using microelectromechanical technologies and planar components
作者： K. Takahashi , U. Sangawa , S. Fujita , M. Matsuo , T. Urabe
DOI: 10.1109/22.963143
关键词:
摘要: A novel millimeter-wave packaging structure was developed in which a micromachined low-loss planar component and flip-chip devices were integrated on silicon substrate. filter achieved 7-mm-square substrate employing an inverted microstrip line unique resonator. High attenuation the stopband also obtained by introducing pole control technique. Fabrication of compact K-band receiver front-end incorporating built-in realized using multilayered benzocyclobutene (BCB) bonding techniques. Furthermore, we propose alternative BCB suspended demonstrate antenna for Ka-band applications. These technologies bring to reality high-performance packaged systems region
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