作者: Jongwan Jung , Shaofeng Yu , Oluwamuyiwa Oluwagbemiga Olubuyide , Judy L. Hoyt , Dimitri A. Antoniadis
DOI: 10.1063/1.1719275
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摘要: Annealing effects on hole and electron mobility in dual-channel structures consisting of strained Si Si1−yGey relaxed Si1−xGex layers (x=0.3/y=0.6, x=0.5/y=0.8) were studied. Hole decreases sharply, but is quite immune to annealing conditions 800 °C, 30 min or 900 °C, 15 s. The decrease more severe with higher Ge contents. degradation a direct result outdiffusion from the layer, resulting decreased content. diffusion preferentially towards buffer rather than cap reason that highly such annealing.