Test apparatus for testing substrates at low temperatures
作者： Matthias Zieger , Axel Schmidt , Frank-Michael Werner , Claus Dietrich , Jorg Kiesewetter
DOI:
关键词:
摘要: A test apparatuss for testing substrates at low temperatures has a chuck, which can be displaced in the working area by means of chuck drive, temperature controlled using heating and cooling means. The receiving surface substrate holding fixing carrier receives substrate. Spatially thermally defined conditions are maintained with minimal energy labor costs both room temperatures. This is achieved providing vacuum chamber surrounds chuck. on one side decoupled from uncooled drive other connected releasable manner to cooled shielded thermal radiation surrounding assemblies directly shield.
lens.org 参考文章(12)
Hiroshi Amemiya, Low-temperature wafer testing method and prober ,(1998)
Julio Guardado, Paul J. Timans, Heating element for heating the edges of wafers in thermal processing chambers ,(1997)
Peter L. Kellerman, Frederick M. Carlson, Pressure controlled heat source and method for using such for rtp ,(2003)
Chiwoei Wayne Lo, Kenichi Kanai, Voltage contrast method for semiconductor inspection using low voltage particle beam ,(1999)
Daniel Joseph Weyers, David Edwards Dean, Non-conductive long wave thermal radiation shield ,(2001)
Thomas R. Omstead, Dorian Heimanson, Temperature controlled chuck for vacuum processing ,(1996)
Paul A. Tervo, Warren K. Harwood, Martin J. Koxxy, Probe station with integrated environment control enclosure ,(1993)
Arnon Gat, Bob Bogart, Heating device for heating semiconductor wafers in thermal processing chambers ,(2000)
F. Kenneth Hollman, High resolution analytical probe station ,(2003)
Steven R. Vosen, Heating device for semiconductor wafers ,(1998)