Electroplating non-metallic surfaces

摘要: In a method for electroplating non-metallic surfaces on substrate (e.g., of plating hole walls in metal clad laminates), metallic sites are formed the surface to be plated and resulting site-containing is electroplated by means an bath comprising component (e.g. dye, surfactant, chelating agent, brightener, levelling agent or pyrophosphate ions) which causes preferentially occur at comparison same as one out; whereby increased rate site achieved with respect reaction consisting out. The allows rapidly uniformly electroplated, without need electrolessly plate first.