Electroplating composition and process
作者： Roger F. Bernards , Wade Sonnenberg , Gordon Fischer
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摘要: A composition for electroplating copper onto a conductive surface comprising solution soluble salt and an acid electrolyte, said being present in concentration of from about 1 to 10 grams per liter whereby the ratio preferably varies between 30 50 1. The is especially useful plating walls cylindrical openings having height diameter at least length 0.100 inches.
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