Programmed pulse electroplating process

摘要: The present invention relates to a method of electrodepositing metal onto substrate, which comprises applying pulsed periodic reverse current across the electrodes plating cell utilizing peak density and forward density; varying ratio in cycles provide deposits uniform thickness appearance upon substrate. also process for improving properties an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse modulation. More particularly, it involves anodic cathodic ratio, order improve surface uniformity appearance, grain structure levelling deposit while maintaining high throwing power.