Polishing head, and chemical-mechanical polishing system for polishing substrate
作者： Shich-Chang Suen , Yung-Cheng Lu , Chin-Hsiang Chan , Liang-Guang Chen
DOI:
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摘要: A polishing head for a chemical-mechanical system includes carrier head, at least one electromagnetism actuated pressure sector and membrane. The is disposed on the head. membrane covers sector.
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