Methods of manufacturing carrier heads for polishing micro-device workpieces
作者： Jason B. Elledge
DOI:
关键词:
摘要: Carrier assemblies, polishing machines with carrier and methods for mechanical and/or chemical-mechanical of micro-device workpieces are disclosed herein. In one embodiment, a assembly includes head having chamber, magnetic field source carried by the head, fluid in chamber. The is configured to generate head. changes viscosity within chamber under influence exert force against at least portion workpiece. can be magnetorheological fluid. include an electrically conductive coil magnet, such as electromagnet. also cell cavity receive
google.com.jm参考文章(127)
Ranjit Bhatia, Address retrieval system ,(1997)
Cyprian E. Uzoh, Electroetch and chemical mechanical polishing equipment ,(1999)
Ludmila Levin, Magnetic polishing fluids for polishing metal substrates ,(2000)
Emil J. C. Hergenroeder, Robert S. Davis, Joseph A. Perrotto, Jig for polishing the edge of a thin solid state array panel ,(1996)
Gurtej S. Sandhu, Laurence D. Schultz, Trung T. Doan, Apparatus for endpoint detection during mechanical planarization of semiconductor wafers ,(1991)
Peter L. Dewalt, Thomas C. Wagner, Continuous strand mats, methods of producing continuous strand mats, and systems for producing continuous strand mats ,(2004)
Eric N. Paton, Method and apparatus for chemical polishing using field responsive materials ,(1999)
Chris Jerbic, Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers ,(1992)
Gurtej S. Sandhu, Chris C. Yu, Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection ,(1991)