Embedded fiber acoustic sensor for CMP process endpoint
作者： Rodney C. Kistler
DOI:
关键词:
摘要: Devices, systems and methods for monitoring characteristics of semiconductor substrates workpieces during planarization endpointing processes are provided. The invention utilizes a fiber optic contact sensor incorporated into planarizing pad or pad-subpad assembly process mechanical energy (e.g., vibration) acoustical ultrasonic that allows an operator to determine status and/or endpoint polishing process. In another embodiment, the table support pad.
lens.org 参考文章(44)
Gurtej S. Sandhu, Chris C. Yu, Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection ,(1991)
Yehiel Gotkis, Aleksander Owczarz, Nicolas Bright, Rodney Kistler, David Hemker, System and method for metal residue detection and mapping within a multi-step sequence ,(2003)
Yehiel Gotkis, Aleksander Owczarz, Nicolas J. Bright, Rodney Kistler, David Hemker, Method and apparatus of arrayed sensors for metrological control ,(2004)
Jason B. Elledge, Methods of manufacturing carrier heads for polishing micro-device workpieces ,(2005)
David Wei, Rodney Kistler, Yehiel Gotkis, Semiconductor structure implementing low-K dielectric materials and supporting stubs ,(2001)
Yehiel Gotkis, Nicolas J. Bright, Rodney Kistler, Vladimir Katz, David Hemker, Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection ,(2002)
David S. Breed, Method and apparatus for sensing a vehicle crash ,(2003)
Scott E. Moore, Method and apparatus for wireless transfer of chemical-mechanical planarization measurements ,(2001)