Shielded carrier with components for land grid array connectors
作者： Zhineng Fan , Ai D. Le , Che-Yu Li
DOI:
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摘要: A shielded carrier with electrical components is provided, resulting in LGA interposer connectors improved performance and enhanced functionality. The includes such as resistors capacitors on and/or the carrier. are preferably of surface mount variety or imbedded within carrier, due to inherent lower profile these form factors. Decoupling terminating two examples that may improve performance.
lens.org 参考文章(8)
Paul T. Phillips, Michael P. Brownell, William A. Samaras, Multi-chip land grid array carrier ,(1999)
David Brian Stone, Passive interposer including at least one passive electronic component ,(1997)
Keith Edward Fogel, Paul Lauro, Maurice Norcott, Brian Beaman, Da-Yuan Shih, Interconnector with contact pads having enhanced durability ,(1995)
Wei Long, Qi Xiang, High K dielectric de-coupling capacitor embedded in backend interconnect ,(2000)
Zhineng Fan, Ai D. Le, Che-Yu Li, Carrier for land grid array connectors ,(2000)
David R. Crotzer, Resilient electrical interconnect ,(1994)
Terrence Evan Lewis, Ronald Jack Kuntz, Mark DeWayne Bestul, Leonard Harry Alton, Connector for making multiple pressed co-axial connections having an air dielectric ,(2000)
Ashok N. Kabadi, Direct BGA socket ,(1998)