High density chip carrier with integrated passive devices
作者： Michael Patrick Chudzik , Anna Wanda Topol , Bruce Kenneth Furman , Chandrasekhar Narayan , Rajarao Jammy
DOI:
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摘要: A carrier for a semiconductor component is provided having passive components integrated in its substrate. The include decoupling components, such as capacitors and resistors. set of connections to provide close electrical proximity the supported components.
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