Method for integrated circuit power and electrical connections via through-wafer interconnects

摘要: A method for providing a through wafer connection to an integrated circuit silicon package. hole is first created in the package with inner surface area extending from bottom of top The by one two methods. involves mechanical drilling diamond bit rotated at high rate speed. second ultrasonically milling utilizing slurry and steel fingers. covered insulating material insulate conductive which later deposited serve as diffusion barrier, then seed placed hole. Finally, filled utilized provide large power inputs or signaling connections chips.