Method for making three dimensional circuit integration
作者： Jeffrey John Welser , Sandip Tiwari , Charles Thomas Black , Joachim Norbert Burghartz
DOI:
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摘要: The present invention relates to a method for interconnecting, through high-density micro-post wiring, multiple semiconductor wafers with lengths of about millimeter or below. Specifically, the comprises etching at least one hole, defined by walls, partly semiconducting material; forming layer electrically insulating material cover said walls; and an conductive on walls within channel hole. Microelectronic devices containing wiring are also disclosed herein.
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