Passive Devices in Package-on-Package Structures and Methods for Forming the Same
作者： Chih-Hua Chen , Chen-Shien Chen
DOI:
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摘要: A device includes a polymer. die is disposed in the passive three Through Assembly Vias (TAVs) penetrating through polymer, wherein TAVs are coupled series. Redistribution Line (RDL) underlying The RDL electrically couples first one of to second TAVs.
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