Method for manufacturing a cubically integrated circuit arrangement
作者： Wolfgang Hoenlein , Siegfried Schwarzl
DOI:
关键词:
摘要: A method used in manufacturing a cubically integrated circuit arrangement. silicon wafer, wherein through pores are produced by electrochemical etching insulated from the and provided with conductive fills, is secured as carrier plate (24) to substrate (21) that has components Terminal pads (25) electrically connected fills arranged on surface of thereby meet contacts (23) at adjoining firmly thereto.
lens.org 参考文章(15)
Rainer Bruchhaus, Volker Lehmann, Method for manufacturing a pyrodetector apparatus ,(1994)
Volker Lehmann, Hans Reisinger, Method of manufacturing a perforated workpiece ,(1993)
Gilbert A. Hawkins, Ronald M. Gluck, Method of making backside illuminated image sensors ,(1992)
Masao Fujitsu Ltd. Pat.Dep. Taguchi, Takashi Fujitsu Ltd. Pat.Dep. Kato, Three-dimensional integrated circuit and manufacturing method therefor ,(1987)
L. T. Canham, Laser dye impregnation of oxidized porous silicon on silicon wafers Applied Physics Letters. ,vol. 63, pp. 337- 339 ,(1993) , 10.1063/1.110035
Y. Hayashi, S. Wada, K. Kajiyana, K. Oyama, R. Koh, S. Takahashi, T. Kunio, Fabrication of three-dimensional IC using `cumulatively bonded IC' (CUBIC) technology symposium on vlsi technology. pp. 95- 96 ,(1990) , 10.1109/VLSIT.1990.111025
Leo Gulvad Svendsen, Nigel Robert Bates, Anisotropically electrically conductive article ,(1990)
Wolfgang Hoenlein, Volker Lehmann, Reinhard Stengl, Hermann Wendt, Josef Willer, Method for manufacturing a solar cell from a substrate wafer ,(1992)
Thomas R. Anthony, Richard J. Connery, David F. Hoeschele, Silicon-on-sapphire body with conductive paths therethrough ,(1980)