3D Technology for intelligent trackers

作者: Ronald Lipton

DOI: 10.1088/1748-0221/5/10/C10006

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摘要: At Super-LHC luminosity it is expected that the standard suite of level 1 triggers for CMS will saturate. Information from tracker be needed to reduce trigger rates satisfy bandwidth. Tracking modules which correlate information closely-spaced sensor layers form an on-detector momentum filter are being developed by several groups. We report on a module design utilizes three dimensional integrated circuit technology incorporating chips connected both top and bottom sensor, providing ability locally. A demonstration chip, VICTR, has been submitted Chartered/Tezzaron two-tier 3D run coordinated Fermilab. concept, status VICTR chip associated integration utilizing oxide bonding.

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