Semiconductor chips and methods of forming the same
作者： Dong-Chan Lim , Byung-lyul Park , Dosun Lee , Gilheyun Choi , Deok-Young Jung
DOI:
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摘要: Provided are a semiconductor chip and method of manufacturing the same. The includes substrate having first side second facing each other, through electrode being disposed in hole penetrating substrate, wherein an opening surrounded by is hole, comprises end adjacent to substrate.
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