作者: Yann Pierre Roger Lamy , Freddy Roozeboom , Willem Frederik Adrianus Besling
DOI:
关键词: Embedded Wafer Level Ball Grid Array 、 Plating 、 Electronic engineering 、 Materials science 、 Layer (electronics) 、 Wafer testing 、 Wafer 、 Die (integrated circuit) 、 Die preparation 、 Optoelectronics 、 Wafer backgrinding
摘要: Therefore, a method of plating wafer via holes in is provided. A substrate (200) having first and second side plurality (210) Each hole comprises end extending between the side. seed layer (220) deposited on 5 (200). foil (250) applied closing ends (210). The electro-chemically plated removed.