作者: Manes Eliacin , Robert B Lempkowski , Junhua Liu , Keryn Lian
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摘要: A meso-scale MEMS device having a cantilevered beam (113) is formed using standard printed wiring board and high density interconnect technologies practices. The includes at least some polymer material (71) to constitute its length, in embodiments also comprises conductive as load-bearing component thereof. In varying embodiments, the attached location proximal an end thereof, or distal