Switching structure and method of fabrication
作者： William Paul Kornrumpf , Robert John Wojnarowski
DOI:
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摘要: A switch structure having a base surface; first high density interconnect (HDI) plastic layer overlying the surface layer; cavity within HDI at least one patterned shape memory alloy (SMA) and cavity, conductive over SMA fixed contact pad attached to movable portion of such that when second layers metallized are in stable position, touches pad, thereby providing an electrical connection forming closed switch. The has position which flexed away from so pads not form open
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