Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
作者： Takashi Masuko , Shigeki Katogi
DOI:
关键词:
摘要: The adhesive composition of the invention comprises (A) a thermoplastic resin with Tg no higher than 100° C. and (B) thermosetting component, wherein component includes (B1) compound an allyl group (B2) maleimide group.
lens.org 参考文章(13)
Hisashi Shimizu, Toshio Shiobara, Minoru Takei, Thermosetting resin compositions ,(1993)
Takeshi Hashimoto, Daisuke Orino, Masaharu Kobayashi, Takeshi Sato, Thermosetting low-dielectric resin composition and use thereof ,(1999)
Joseph Anthony Aurichio, Joseph Robert Zingaro, Jagadish Chandra Goswami, Thermally stable adhesive ,(1985)
Bruce Marshall Torrey, Geoffrey Henry Riding, Adeyinka Adedeji, High performance plastic pallets ,(1999)
K. Ambika Devi, C. P. Reghunadhan Nair, K. N. Ninan, Diallyl bisphenol A—novolac epoxy system cocured with bisphenol-A-bismaleimide—cure and thermal properties Journal of Applied Polymer Science. ,vol. 106, pp. 1192- 1200 ,(2007) , 10.1002/APP.26734
Takashi Masuko, Masanobu Miyahara, Keisuke Okubo, Adhesive composition, filmy adhesive, adhesive sheet, and semiconductor device made with the same ,(2007)
Tetsuya Miyamoto, 哲也 宮本, Masakazu Kawada, 政和 川田, Anisotropic electroconductive adhesive ,(2001)
Toomasu Purotsusaa Demasu Jiyu, Ronarudo Yuujiin Howaito, NOVEL ANTIMICROORGANISM LACTAM-QUINOLONES ,(1991)
Yuzo Akata, Keiji Nakamoto, Kazuo Iko, Adhesive sheet for die bonding ,(1989)
Miyadera Yasuo, Takeda Shinji, Masuko Takashi, Yusa Masami, Maekawa Iwao, Kageyama Akira, Yamazaki Mitsuo, Kaneda Aizo, Sato Chuji, Miyamae Yusuke, Saito Makoto, Kikuchi Noburu, Kotado Akio, METHOD AND APPARATUS FOR LAMINATING FILM-LIKE ORGANIC DIE BONDING MATERIAL, METHOD AND APPARATUS FOR DIE BONDING, SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF ,(1997)