Thermosetting low-dielectric resin composition and use thereof

摘要: A thermosetting low-dielectric resin composition which has a low dielectric constant and tangent for use in printed circuit board excellent adhesion to metal scatters almost no when used forming prepreg by punching or cutting, the comprising component (a): siloxane-modified polyimide, (b): compound containing 2 methylallyl groups having following formula (1) 3 allyl (1A), (c): at least maleimide groups, wherein R is hydrogen atom methyl group.