Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
作者： Nozomu Takano , Kazuhito Obata , Yoshitsugu Matsuura , Katsuyuki Masuda , Yuuji Ooyama
DOI:
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摘要: A printed wiring board prepreg according to the present invention is a obtained by impregnation-drying of base material with thermosetting resin composition, and when it bent 90°, cracks do not occur in material.
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