PLATING APPARATUS AND SUBSTRATE HOLDER USED WITH PLATING APPARATUS
作者： Tamura Sho , Hirao Tomonori , Yokoyama Toshio
DOI:
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摘要: PROBLEM TO BE SOLVED: To provide a plating apparatus capable of controlling process individually on front surface and back substrate holder usable for such apparatus.SOLUTION: There is provided holding which an object to be plated during processing, has main body portion the includes first opening second portion, configured that region exposed by when held in at least part outer peripheral seal protruding from portion.SELECTED DRAWING: Figure 3A
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