Method for forming a heat dissipation apparatus
作者： Guillermo L. Romero , Joe L. Martinez
DOI:
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摘要: A heat dissipation apparatus having a base structure (11) and fins (29, 43) method for making the apparatus. The is formed as molded porous preform top surface (12), bottom (13), grooves (14) in (13). layer of dielectric material (17) placed on (12) infiltrated with conductive material, thereby bonding to (11). are coated epoxy (29) inserted into form (30). Alternatively, (43) when forming unitary (44).
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