Semiconductor device and semiconductor production management system
作者： Hidemitsu Naya , Rikio Tomiyoshi , Koji Hashimoto , Masamichi Kawano
DOI:
关键词:
摘要: A semiconductor chip (2) to be packaged in a device (1) is provided with circuit pattern (2B) addition primary (2A). Every has different (2B). By having the carry an identifying information, information which difficult altered. production management system intended for product mounted and can manage from state of use also disclosed.
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