Method of manufacturing light emitting device
作者： Takeaki Shirase , Kosuke Matoba
DOI:
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摘要: A light emitting device is manufactured in which a cap having frame portion bonded to package element mounted recess of the cover an opening recess. method for manufacturing includes: partially disposing metal bonding agent, greater wettability than package, one and portion; by extending agent along so that ends are joined each other while defining space at joining where joined.
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